{"id":25396,"date":"2025-04-20T21:27:19","date_gmt":"2025-04-20T14:27:19","guid":{"rendered":"https:\/\/aie.com.vn\/?p=25396"},"modified":"2025-04-20T21:29:37","modified_gmt":"2025-04-20T14:29:37","slug":"zeiss-scanbox-encourages-collaboration-between-colleges","status":"publish","type":"post","link":"https:\/\/aie.com.vn\/en\/zeiss-scanbox-encourages-collaboration-between-colleges\/","title":{"rendered":"Zeiss ScanBox Encourages Collaboration Between Colleges"},"content":{"rendered":"
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Zeiss ScanBox gift delivers on cross-college collaboration, increases students\u2019 workforce readiness<\/h1>\n<\/header>\n

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An internal view of Purdue Polytechnic\u2019s new ScanBox in Lambertus Hall\u2019s Build @ Scale Lab. (Purdue University photo\/John O\u2019Malley)<\/em><\/p>\n

Last month, Purdue Polytechnic faculty and executives gathered with representatives from Zeiss, Howmet Aerospace and with peers in the industrial engineering program at Purdue to celebrate the recent installation of a Zeiss ScanBox 5120, that was made possible through Howmet Aerospace Foundation.<\/p>\n

What the ScanBox does<\/h4>\n

With its ScanBox products, Zeiss has become an important player in the applied and industrial applications of metrology, the science of measurements. Purdue Polytechnic\u2019s leading faculty member in this field is Paul McPherson, a professor of practice in engineering technology who facilitated many relationships in order to acquire and house the ScanBox for use in multiple courses, including one where students will receive certification on the machine.<\/p>\n

\u201cThis machine allows manufacturing facilities to scan manufactured parts and then overlay the scan to the \u2018perfect\u2019 digital version of the model to determine how in or out of specification the part is,\u201d McPherson explained. The ScanBox\u2019s camera is capable of\u00a0capturing<\/a>\u00a012 million individual points per scan, and since it is attached to a programmable, moving arm, it takes multiple scans from many angles and turns it into a digital \u201cmesh.\u201d This mesh can then be used to reverse engineer a component or compare it to the computer-aided design (CAD) model.<\/p>\n

Scanning technology of this kind has wide industrial applications, from creating accurate parts for automobiles and planes, to crafting near-flawless molds in the metal casting and manufacturing process and beyond. The ScanBox supplies a learning opportunity for faculty as well as students, as this particular method of metrology is more heavily automated than many of the alternatives that have been available on campus.<\/p>\n

Increasing collaboration across colleges<\/h4>\n

\u201cFrom my industry career, I\u2019m a construction management person. And I can tell you\u2014I love 3D scan technology like this,\u201d Daniel Castro, Purdue Polytechnic\u2019s dean, said. \u201cIt\u2019s totally revolutionized construction. And if this gift is any indication, it\u2019s doing it all over again in manufacturing.\u201d<\/p>\n

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Representatives from Howmet and Zeiss joined Purdue for the ScanBox ribbon cutting. Purdue members, from left to right, include Ken Burbank, Daniel Castro, Young-Jun Son and Paul McPherson. (Purdue University photo\/John O\u2019Malley)<\/em><\/p>\n

At present the ScanBox is meant to serve as a foundational training device in multiple metrology courses and will provide the opportunity for a certificate program. This program is most useful for students in Purdue Polytechnic\u2019s mechanical engineering technology (MET) and manufacturing engineering technology (MFET) majors. However, since advanced metrology is equally useful for students in Purdue\u2019s College of Engineering\u2014particularly in their School of Industrial Engineering (IE)\u2014IE students have the opportunity to take the same course alongside their peers in MET and MFET. This will count toward IE\u2019s minor in manufacturing.<\/p>\n

\u201cIn STEM, technology is really the practical application of science, math and engineering,\u201d said, Ken Burbank, head of Purdue Polytechnic\u2019s School of Engineering Technology. \u201cAnd an investment like this from Howmet, who Paul has introduced us to, really shows the depth of Purdue\u2019s commitment to technology. This piece is going into the single largest teaching space on campus.\u201d<\/p>\n

The ScanBox resides within industrial engineering\u2019s \u201cBuild @ Scale\u201d lab, housed within Lambertus Hall. This marks the first instance of cross-pollination in a physical teaching space between Purdue Polytechnic and the College of Engineering since the building\u2019s dedication, where deans of both colleges\u00a0remarked<\/a>\u00a0that Dudley and Lambertus Halls should be a place of collaboration among students and faculty.<\/p>\n

Preparing students for the future of work<\/h4>\n

Josh Smith, the engineering manager at Howmet\u2019s La Porte, Indiana location, said that having a pool of recent graduates with some preexisting training in advanced metrology would be \u201cabsolutely massive\u201d for the company. \u201cWe are going further and further into the 3D modeling, CAD space,\u201d Smith stated. \u201cBut frankly, we have this noticeable gap in education. A lot of universities have people with experience, but they don\u2019t actually use it. Or they\u2019re not willing to invest in the technology itself.\u201d<\/p>\n

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Josh Smith, engineering manager at Howmet. (Purdue University photo\/John O\u2019Malley)<\/em><\/p>\n

\u201cIt\u2019s a big deal that Howmet invested in us, because you\u2019re talking about a single piece of equipment that would be half-a-million dollars at full retail value,\u201d McPherson added. \u201cAnd it\u2019s the cost of entry with this technology, as well as the small pool of people who are willing to adapt to it which have made this so rare in education. As far as I know, we\u2019re one of the first colleges to have this particular piece in an undergraduate teaching lab\u2014maybe even around the world, that\u2019s how rare this is.\u201d<\/p>\n

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\nThe Capture3D\/Zeiss ScanBox, a rare piece of equipment in higher education, will be used in a suite of courses that will enhance collaboration between multiple majors in the Polytechnic and the College of Engineering. (Purdue University photo\/John O\u2019Malley)<\/em><\/p>\n

Smith also emphasized that Howmet is looking to do more than just fast-track new employees by giving them a head start on certification and training. He hopes this will also provide \u201clongevity and long-term success\u201d as employees get into their roles. \u201cI think for us, we\u2019re just going to see a higher success rate, where we\u2019re putting the right person in the best position for them. They can enter a role with some expectation of what they\u2019re getting into. At present, it\u2019s kind of a black box because students aren\u2019t exposed to 3D capture technology to this level.\u201d<\/p>\n

Regarding future collaboration with industrial engineering (including students, faculty and School Head Young-Jun Son, who was also present), McPherson looks forward to \u201ccontinuing onward, I hope for years to come.\u201d<\/p>\n

\u201cFor both of us, it\u2019s all about updating the equipment we all teach on to the latest and greatest, right? So it was very positive, and really a no-brainer, to get both colleges involved and to work out teaching opportunities that both parties wanted to say \u2018yes\u2019 to.\u201d<\/p>\n","protected":false},"excerpt":{"rendered":"

Zeiss ScanBox gift delivers on cross-college collaboration, increases students\u2019 workforce readiness An internal view of Purdue Polytechnic\u2019s new ScanBox in Lambertus Hall\u2019s Build @ Scale Lab. (Purdue University photo\/John O\u2019Malley) Last month, Purdue Polytechnic faculty and executives gathered with representatives from Zeiss, Howmet Aerospace and with peers in the industrial engineering program at Purdue to…<\/p>\n","protected":false},"author":1,"featured_media":25388,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[168],"tags":[],"class_list":["post-25396","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-blog-en-2"],"_links":{"self":[{"href":"https:\/\/aie.com.vn\/en\/wp-json\/wp\/v2\/posts\/25396","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/aie.com.vn\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/aie.com.vn\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/aie.com.vn\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/aie.com.vn\/en\/wp-json\/wp\/v2\/comments?post=25396"}],"version-history":[{"count":2,"href":"https:\/\/aie.com.vn\/en\/wp-json\/wp\/v2\/posts\/25396\/revisions"}],"predecessor-version":[{"id":25398,"href":"https:\/\/aie.com.vn\/en\/wp-json\/wp\/v2\/posts\/25396\/revisions\/25398"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/aie.com.vn\/en\/wp-json\/wp\/v2\/media\/25388"}],"wp:attachment":[{"href":"https:\/\/aie.com.vn\/en\/wp-json\/wp\/v2\/media?parent=25396"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/aie.com.vn\/en\/wp-json\/wp\/v2\/categories?post=25396"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/aie.com.vn\/en\/wp-json\/wp\/v2\/tags?post=25396"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}